Call for Presentations:

Speak at AEC M&A Summit!

AEC M&A Summit is the premier event for architecture, engineering, and consulting firm buyers and sellers, investors focused on exit strategies or growth through mergers, acquisitions, and strategic partnerships. We’re accepting proposals for a limited number of speaking sessions.

Submit your proposal to share your firm’s M&A experience, position yourself as a thought leader, contribute to advancing the industry, and receive a FREE conference registration (a $2,595 value).

Proposal Deadline: December 1, 2026

Selected speakers receive the opportunity to share their expertise with senior executives from architecture, engineering, and consulting (AEC) firms actively involved in mergers, acquisitions, ownership transitions, and strategic growth. As a speaker, you’ll also receive complimentary registration to the AEC M&A Summit (a $2,595 value).

Proposals should provide actionable guidance on relevant topics, including:

  • M&A Strategy & Growth
  • Buy-Side and Sell-Side Best Practices
  • Valuation, Deal Structuring & Due Diligence
  • Integration, Culture & Change Management
  • Ownership Transition & Succession Planning
  • Financial, Legal & Operational Considerations


When reviewing submissions, we give preference to presentations that provide:

  • Proven strategies and real-world lessons from successful mergers, acquisitions, or ownership transitions.
  • Timely, relevant insights for AEC firm leaders navigating growth, succession, and market consolidation.
  • Practical, actionable takeaways attendees can implement within their own organizations.

Please note that breakout sessions are educational in nature and may not include promotional or sales-focused content. To showcase a product or service to the AEC audience, explore our sponsorship opportunities.

Submit Your Speaking Proposal:

AEC M&A Summit is a registered provider of AIA-approved continuing education. For more information, please contact our education team at (617) 965-0055 or education@psmj.com.